Variety of packaging options

Wide range of packages in QFN, LQFP, CSP

Tested wafers, bumping, die in waffle pack, die on tape & reel

Stacked die, MCM

Production testing

In-house mixed signal testing services at probe & package

• Package handler to reduce test time

In-house temperature & speed testing

In-house product characterization and engineering

• Well equipped lab including hot/cold temp chamber

• Characterization over military temp range

RF & high pin count 3rd party test partners

MLM, MPW, Consignment, Die Banking

Multi Layer Mask: Multiple masks per reticle to reduce NRE

Multi Project Wafer: Shared masks & wafers to reduce NRE

Die Banking: Shortened leadtime & lifetime extension

Quality

ISO 9001-2000 quality flow

MIL-STD-883 screening

Qualification & burn-in (life test and burn in – in house)

Local failure analysis (MEFAS/EAG)